برد های الکترونیکی HDI

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موضوع:مروری بر استاندارد مربوط به برد فرکانس بال(۳08 1 تهیه کننده: 0 

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HDI = High Density Interconnect 

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Topics Definitions / Standards (IPC) Pros & Cons Key equipment Build-ups Choice of material Design rules IPC - HDI - reliability (uvia stacked / filled) (Copper pillar technology) 

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ions / Standards for HDI IPC-2221A Generic Standard on Printed Board Design (5/03) IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards (2/98) Final draft A 0 Design and Assembly Process Implementation for BGAS ) Peet Generic Performance Specification for Printed Boards 196) IPC-6012B Qualification and Performance Specification for Rigid Printed Boards (03/08) Final draft C IPC-4101C Specification for Base Materials for Rigid and Multilayer Boards (07/09) 

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Definitions / Standards for HDI IPC-DD-135 Qualification Testing for Deposited Organic interlayer Dielectric Materials for Multichip Modules (8/95) IPC-2226 Sectional Design Standard for High Density Interconnect (HDI) Boards (04/03) IPC/JPCA-2315 Design Guide for High Density Interconnects (HD!) and Microvia (06/00) ۱۳۵-۵۵16 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards (05/99) IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials (5/99) 

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Definitions / Standards for HDI HDI general description Printed circuit board with a higher wing density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (< 100 um), smaller vias (<150 ym) and capture pads (<400 um), and higher connection pad density (>20 pads/em2) than employed in conventional PCB technology. IPC-2226 definition of microvia A blind hole with a diameter (<150 um) having a pad diameter (S350 um) formed by either laser or mechanically drilling. IPC-T-50H: High Density interconnect (HDI) Ageneric term for substrates or boards with a higher circuit density per unit area than conventional printed boards. 

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IPC-2226 defines HDI in 6 classes Type I 1(C)O or 1(C)1 *Defines a single microvia layer on either one or both sides of core. *Core can be multilayer, rigid or flex. *Core is typically manufactured using conventional ۷۵ techniques. “Uses both plated microvias and plated through holes for interconnection. +Employs blind, but not buried vias. 

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IPC-2226 defines HDI in 6 classes Type Il 1(C)0 or 1(C)1 “Defines a single microvia layer on either one or both sides of core. *Core can be multilayer, rigid or flex. 5 “Core is typically manufactured using conventional PWB techniques. “Uses both plated microvias and plated through holes for interconnection. +Employs blind and buried vias. 

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IPC-2226 defines HDI in 6 classes Type Ill 2 2 (C) 20 Defines at least two layers of microvia layers on either one or both sides of core. *Core can be multilayer, rigid or flex. “Core is typically manufactured using conventional PWB 1 techniques. | *Uses both plated microvias and | plated through holes for | interconnection. +Employs blind and buried vias. 

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IPC-2226 defines HDI in 6 classes Type IV 21 (P) 20 *Defines to have at least one microvia layer on either one or both sides of core. “Core is typically manufactured using conventional PWB techniques. “Uses both plated microvias and plated through holes for interconnection “Uses a passive core not electrically connected, used normally for CTE management, 

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IPC-2226 defines HDI in 6 classes Type V Coreless Uses thin “cores” which uses both plated microvias and conductive paste interconnections. *Uses B-stage resin system prepreg where conductive material locally have been placed 

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IPC-2226 defines HDI in 6 classes Type VI Constructions +A construction where connections are buildup without normal plating. +The connections are formed with conductive ink, or other type of conductive material. “Examples as ALIVH (Any-Layer, Inner Via Hole and PALAP (Pattered Prepreg Lay Up Process ) both Japanese inventions. 

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Pros & Cons HDI PCB Pros + Increased interconnection density by miniaturization of holes, pads and conductors + Provides the possibility to have a via hole connect direct in the SMD or BGA pad. + Improved signal integrity due to reduced tracklength. + Improved possibility to maximization of ground connections. + Opportunities of better thermal enhancement. + Improved reliability by stepping up technology rather than compromising existing design rules. 

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Pros & Cons HDI PCB Cons + Some technologies are at early stage yet. + There are different ways to achieve similar technology (copper filling, drilling). + Lower Yield. + Most suppliers “can do everything” (risks costly experience). + Limits available suppliers + Stepping up to advanced technology without proper need (or knowledge). + Expensive equipment. 

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Production key equipment Class 1000 clean room with auto alignment exposure units and LDI 

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Production key equipment Automatic lay up and high capacity lamination press with auto-loading 

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New generation of CO? laser drilling machines 

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Good HDI Cu plating solution with horizontal copper plating line plus vertical continuous plating line 

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Build-ups All the structure as above are available for mass production 

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Choice of Material There are a wide range of materials that can be used for build-ups on HDI boards. + RCC (Resin coated copper) +LDP (Laser drillable prepreg) + PP (prepreg) + NWA (Non woven aramide) epoxy & polyimide + Polyimide + Speedboard C (Gore) The most common are RCC, LDP and PP 

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Choice of Material RCC (Resin coated copper) This is as the name indicates a copper foil which are treated with epoxy resin. It is normally applied in two layers one layer with fully cured epoxy (c-stage) and a layer with semi cured epoxy (b-stage). Normally values are 25 or 35um of c-stage epoxy and 35ym of b-stage epoxy. 

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Choice of Material RCC (Resin coated copper) Benefits + Easy to drill + Even surface for fine lines Disadvantages + High CTE values + Expensive + Lower amount of resin + Lower peel strength than LDP + Requires an even surface that it's bonded to + Mismatched Dk with the core layer * Short shelf life 

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Choice of Material LDP (Laser Drillable Prepreg) This is as the name indicates a prepreg that has been more adopted for laser driling, the fiber bundles are more uniformly distributed so the laser beam always drills in a uniform material. This is very important since the epoxy is very easy to drill, but the glass fibers are more difficult. The laser drillable prepregs are normally made only in 106, 1080 & 2116 style. 

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Choice of Material LDP (Laser Drillable Prepreg) Benefits + Cheap + Same CTE as core layer + High amount of resin + Same Dk as core layer + High peel strength + Woven material - increased rigidity + Long shelf life isadvantages + More difficult to drill then RCC 

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Choice of Material What material should be used? Since HDI boards are a more sensible in construction and we now have switched to lead-free soldering there is a need for better material than for conventional multilayer boards. They key parameters are: * Total CTE in Z-axis * Decomposition temperature + T7260 +7288 * Glass transition temp (Tg) 

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Choice of Material New materials according to IPC-4101C 

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Choice of Material Conclusions: + Use LDP instead of RCC foil as material for yvia + Use high quality FR4 in cores and Prepreg + Specify the material according to IPC standard 

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